Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.
Features
Low-modulus polymer material
Available with fiberglass/rubber carriers or in a non-reinforced version
Special fillers achieve specific thermal and conformability characteristics
Highly conformable to uneven and rough surfaces reducing interfacial resistance
Electrically isolating
Natural tack on one or both sides with a protective liner
Variety of thicknesses and hardnesses
Range of thermal conductivity
Available in sheets and die-cut parts
Eliminates air gaps to reduce thermal resistance
Low-stress vibration dampening
Shock absorbing
Easy material handling
Simplified application
Puncture, shear, and tear-resistant
Improved performance for high-heat assemblies
Compatible with automated dispensing equipment
Applications
Between an IC and a heat sink or chassis (typical packages include BGAs, QFP, SMT power components, and magnetics)
